CV, PCB Designer Targeting Europe, North America, Asia

Available
Serial No: 48318
Skills keywords: electronic engineer, pcb design
Current location:  England, United Kingdom - View on map
Nationality: British
Spoken languages: basic German, Basic Japanese, english

PROFILE

Experienced team leader with 21 years experience in the PCB Industry. Successful PCB designer for Switched Mode Power Supplies and Mobile Phones products.

Supervising and organising the introduction of new PCB technologies and CAD Tools.

Mentoring and coaching PCB Engineers to improve their design capabilities and ultimately design quality.

Excellent leadership skills with a methodical approach to planning and organisation. Strong focus to delivering projects on time and meeting the requirements.

KEY SKILL AND COMPETENCES

PCB Design using latest PCB technologies; PCB Manufacturing and Assembly Knowledge; PCB Design Tools Used–Mentor Graphics PADS & Boardstation, Zuken CR5000; Mechanical and Thermal Design Tools – Solidworks, AutoCAD, Flow Simulation; Communication and Leadership

Methodical approach to planning and organisation; strong Decision Making

CAREER

Oct 2012–Present
TDK-Lambda Advanced Technology Centre, Bristol, UK
Senior Mechanical/PCB Designer

General activities:

Assisting with the development of new Power Supply Concepts by creating PCB layouts. Identifying best thermal simulation tool for PCB Design. Various tools reviewed (IcePak, Flotherm, COMSOL, Flow Simulation)

Identifying new substrate solutions and materials to meet the thermal challenges for future products. Copper coin technology PCB`s designed, manufactured with high thermal conductivity material and tested.

Key Achievements:

Successful, on-time, high quality PCB designed;  Identification of PCB technologies such as copper coins and high thermal conductivity materials to overcome thermal challenges

Creation of new Design Standards for low voltage designs; PCB Technology evaluation boards designed and used in verification process

Mechanical drawings for transformer, chokes and heatsinks

2002-Sept 2012
Nokia UK /Southwood, UK
Nokia GmbH – R&D Center / Ulm – Germany
PCB and FPC Operational Leader

General activities:

Global position with responsibilities covering all R&D Sites. Focused to ensuring the quality of PCB’s designed were at a high level to meet Product requirements and within cost targets.

Global Owner for Standards, Specifications and Design Process that guided the PCBdesign principles used for all PCB’s within the Company. New technologies such as Rigid-Flex required new Standards and Guidelines so it could be included in Products

Driving and leading CAD Tool Evaluations, conducted in close cooperation with CAD

Tool Partners. Schematics for new products were designed as part of a Schematic

Capture and Data Management Tool Evaluation. Both Tools became standard for the Company.

Engaging and leading local and virtual teams of varying sizes to achieve best results in all work. Small teams could be 2 people as with the CAD Evaluation on Zuken System

Key Achievements:

Design Quality improvements across all R&D Sites; Standards, Specification and Process Ownership supported by PWB Manufacturers

1999-2002
Nokia Japan – R&D Center / Tokyo – Japan
PCB Team Leader

General activities:

PCB Team Leader requested to build a new PCB Design team and Design Environment in a new R&D Center in Japan.

The PCB Team supported several Products in a highly professional manner succeeding in realising successful products launches.

Key Achievements:

Creation of a professional, reliable PCB Design Team

Successful program execution with new, inexperienced team

EDUCATION

1985 – 1990 Paisley College of Technology, Paisley, Scotland, UK
B Eng (Hons) Degree Electrical and Electronic Engineering






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