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As described in my enclosed CV, I received my PhD degree in mechanial Engineering from one of the prestigous universities in Tokyo, Japan. During my PhD program, I worked as research associate mainly on innovative type of heat pipe with innovative application. I started my first professional job in a Japanese comany closely related to my field. I have strong background in both engineering and academic and able to analyse Engineering problems in a scientific way.
Qualifications
2000/04/01－ 2008/03/25
Doctorate of Mechanical Engineering, WASEDA University, Graduate school of Engineering, Department of Mechanical Engineering, Tokyo, Japan
1997/10/01－1999/07/01
Master of Mechanical Engineering, Tehran University, Graduate school of Engineering, Department of Mechanical Engineering, Tehran, Iran
1991/10/01－1995/07/01
Bachelor of Mechanical Engineering, Islamic Azad University Tehran Central Branch, school of Engineering, Department of Mechanical Engineering, Tehran, Iran
Career Summary
2008/04/01－2014/03/15
Fujikura Ltd., Printed Circuit Technology R&D Department, Thermal Technology Division, Tokyo, Japan
2006/04/01－2008/03/31
Research associate, WASEDA University, Japan
2003/09/01-2006/03/2006
Visiting research associate, WASEDA University, Japan
Field of expertise:
Thin thermal solution by synthetic jet, Advance thermal solution for high density electronic circuit, Piezo fan, thermoelectric devices, COP Improvement of air conditioner
Patents:
1) Japanese patent, “Evaporator for Micro Loop Heat Pipe”, Patent No. 2008-249040
2) Japanese patent, “The enhancement of night sky cooling by PCM thermal storage in solar PV concentrator module”, Patent No. 2009-058902
3) Japanese patent, “Application of solar concentrator with thermoelectric generator (TEG) for electricity generation”, Patent No. 2009-238642.
4) Japanese patent, “Three Dimensional Thermoelectric cooler Stack”, Patent No. 2009-231906.
5) Japanese patent, “Cooling flat PV panels by Pulsating Heat Pipe (PHP)”, Patent No. 2009-257351.
6) Japanese patent, “Heat Spreader”, Patent No. 2013-106982
Japanese patent, “Cooling Method of Semiconductor Package”, Patent No. 2013-181041
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